Non-Destructive Failure Analysis and Measurement for Molded Devices and Complex Assemblies with X-ray CT and 3D Image Processing Techniques
نویسندگان
چکیده
In both automotive and healthcare sectors, reliable failure analysis and accurate measurement of molded devices and complex assemblies are important. Current methods of failure analysis and measurement require these molded parts to be cross-sectioned so that internal features or dimensions can be accessible. As a result, the parts are deemed unusable and additional failure introduced by sectioning may cause misinterpretation of the results. X-ray CT and 3D image processing techniques provide a new nondestructive solution for failure analysis and measurement of molded devices and complex assemblies. These techniques simplify failure analysis and measurement of molded devices and assemblies, and improve the productivity of molding manufacturing significantly.
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